A novel 1700V RET-IGBT (recessed emitter trench IGBT) shows record low VCE(ON), enhanced current handling capability and short circuit robustness

I. Deviny, H. Luo, Q. Xiao, Yao Yao, Chunlin Zhu, L. Ngwendson, Haibo Xiao, X. Dai, Guoyou Liu
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引用次数: 10

Abstract

In this paper, a novel 1700V recessed emitter trench IGBT (RET-IGBT) is proposed. The RET-IGBT features an additional recessed trench between two adjacent active trenches and under the emitter contact, which reduces the drawn trench to trench separation from 6μm to 2μm. Combined with a double-dose carrier storage (CS) layers, the injection enhancement effect is enhanced. As a result, the trade-off relationship between Vce(on) and £off is improved. The fabricated RET-IGBT shows record low Vce(on) of 1.65V at 150A(110A/cm−2), no degradation in breakdown voltage and short circuit performances whilst enhancing the current handling capability in spite of increased current density.
一种新颖的1700V RET-IGBT(嵌入式发射极沟槽IGBT)具有创纪录的低VCE(ON),增强的电流处理能力和短路鲁棒性
本文提出了一种新型的1700V凹槽发射极沟槽型IGBT (RET-IGBT)。RET-IGBT在两个相邻的有源沟槽之间和发射极触点下方增加了一个凹槽,从而将绘制沟槽到沟槽的距离从6μm减少到2μm。与双剂量载流子存储层(CS)相结合,增强了注射增强效果。因此,Vce(on)和£off之间的权衡关系得到了改善。制备的RET-IGBT在150A(110A/cm−2)下显示出1.65V的低Vce(on),击穿电压和短路性能没有下降,同时增强了电流处理能力,尽管电流密度增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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