Mechanisms Governing Longitudinal AC Breakdown at Solid-Solid Interfaces

Emre Kantar
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引用次数: 2

Abstract

Insulation systems incorporating multilayer dielectrics are commonly used in many high-voltage applications where the interfaces between the dielectric layers are the most vulnerable regions. The primary purpose of this paper is to elucidate the mechanisms theoretically and experimentally that govern the AC breakdown of solid-solid interfaces. Two different polymers with different elastic moduli were tested. The interfaces were formed between the same specimens and were AC breakdown tested at various contact pressures. In addition, interface surfaces were polished using two different sandpapers of different grit sizes to study the effect of surface roughness. A comprehensive interface breakdown model was employed to scrutinize morphologies of solid-solid interfaces in relation to the measured interfacial AC breakdown and PD inception field strengths. PD activity in the cavities and electrical tracking resistance of contact spots between the cavities were found to be significantly affecting the interfacial breakdown phenomenon.
固-固界面纵向交流击穿控制机制
包含多层介质的绝缘系统通常用于许多高压应用,其中介电层之间的界面是最脆弱的区域。本文的主要目的是阐明控制固-固界面交流击穿的理论和实验机制。测试了两种不同弹性模量的聚合物。在相同试样之间形成界面,并在不同接触压力下进行交流击穿试验。此外,使用两种不同粒度的砂纸对界面表面进行抛光,研究表面粗糙度的影响。采用一个综合的界面击穿模型来仔细研究固-固界面的形态与测量的界面交流击穿和PD初始场强的关系。发现腔内PD活性和腔间接触点的电跟踪电阻对界面击穿现象有显著影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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