Low power MEMS oscillators for sensor applications

C. Do, A. Erbes, Jize Yan, A. Seshia
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引用次数: 7

Abstract

In this paper, we report on the design of a low power CMOS oscillator front-end interface circuit for micromachined resonant sensors. The circuits are fabricated in a standard 0.35 μm process while the MEMS resonators are fabricated in a SOI-MEMS foundry process with the two die electrically integrated through wirebonding in a ceramic package. The oscillator core draws less than 1μA at 1.2V supply while demonstrating a short-term frequency stability of less than 0.5 ppm.
用于传感器应用的低功耗MEMS振荡器
本文报道了一种用于微机械谐振传感器的低功耗CMOS振荡器前端接口电路的设计。电路采用标准的0.35 μm工艺制造,而MEMS谐振器采用SOI-MEMS代工工艺制造,两个芯片通过陶瓷封装中的线键电集成。该振荡器芯在1.2V电源下的功耗小于1μA,同时显示出小于0.5 ppm的短期频率稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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