UV-LIGA microfabrication for high frequency structures of a 220GHz TWT amplifier

2016 IEEE International Vacuum Electronics Conference (IVEC) Pub Date : 2016-04-19 DOI:10.1109/IVEC.2016.7561803

Hanyan Li, Dong Li, Y. Hu, P. Pan, Tianyi Li, Jinjun Feng

引用次数: 3

Abstract

In this paper, we fabricate copper high frequency structures for a 220GHz TWT amplifier using UV LIGA technology. The two halves have been assembled and bonded. The measurement results of the folded waveguide circuit show that the attenuation factor of the circuit is 240 dB/m.

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220GHz行波管放大器高频结构的UV-LIGA微加工

本文采用UV LIGA技术制备了用于220GHz行波管放大器的铜高频结构。这两部分已经组装并粘合在一起了。对折叠波导电路的测量结果表明，该电路的衰减系数为240 dB/m。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2016 IEEE International Vacuum Electronics Conference (IVEC)

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