Active Thermal Architecture: CubeSat active thermal control in support of advanced payloads

Abstract

The Active Thermal Architecture (ATA) is an advanced sub-1U Active Thermal Control technology (ATC) for high power payload support in 6U CubeSat form factors and above. The design utilizes a two-stage, single-phase mechanically pumped fluid loop coupled through a two-axis flexible rotary fluid hinge, to reject thermal power to a deployable tracking radiator. A COTS Ricor K508N cryocooler forms the second stage and provides cryogenic cooling to a custom Kevlar detector mount through a TMT pyrolytic graphene thermal strap. Passive vibration isolation and damping technologies prevent the transfer of jitter to the satellite systems. The ATA design utilizes state-of-the-art 3D fabrication techniques such as Ultrasonic Additive Manufacturing (UAM) to directly embed the working fluid channels into the HX, radiator, and CubeSat chassis allowing for the miniaturization and simplification of the ATA system into an integrated thermal control solution. This paper will focus on the design and ground-based characterization and qualification of the ATA system and provide performance metrics for its use as a thermal support subsystem for advanced infrared electro-optical CubeSat payloads. The ATA project is funded through a NASA Small Satellite Technology Program (SSTP) and is a partnership between the Center for Space Engineering at Utah State University and the Jet Propulsions Laboratory. The ATA active thermal control system has been raised to a TRL of 6 and hopes to provide payload support to advanced missions such as the SABER-Lite and JPL CIRAS projects.