Effect of interface polarization on dielectric properties in nanocomposite compounded with epoxy and montmorillonite

2013 IEEE International Conference on Solid Dielectrics (ICSD) Pub Date : 2013-10-08 DOI:10.1109/ICSD.2013.6619856

N. Guo, J. Zhang, Liwei Liu, Taiming Zhang, Xiaohong Zhang

{"title":"Effect of interface polarization on dielectric properties in nanocomposite compounded with epoxy and montmorillonite","authors":"N. Guo, J. Zhang, Liwei Liu, Taiming Zhang, Xiaohong Zhang","doi":"10.1109/ICSD.2013.6619856","DOIUrl":null,"url":null,"abstract":"Epoxy/organic-montmorillonite nanocomposites were prepared with different organic-montmorillonite and content of montmorillonite by diglycidyl ether of bisphenol A. Chemical composition of different organic-montmorillonite was analyzed by Fourier Transition Infrared(FTIR). The temperature properties of resistivity of composites were measured by Megger. The temperature dependence of composites dielectric spectrum was verified by using a Schering bridge. The results show that whether octadecyl ammonium chloride or the coupling agent KH550, they can interact with the montmorillonite both. The test results of the composite indicated that, inclusion of K-MMT and O-MMT into epoxy matrix can reduce permittivity and dissipation factor. The permittivity and dissipation factor of K-MMT/EP composites respectively reduced 5% and 35%, and those of O-MMT/EP composites respectively reduced 16% and 41%, when testing temperature is 160°C. It can be confirmed that epoxy improved by organic-montmorillonite is provided with better heat resistance property than those of pure epoxy. As for O-MMT/EP composites, the permittivity and dissipation factor of composites that contains 5wt% O-MMT is lowest. For instance, the permittivity reduced 18% and the dissipation factor reduced 42% than pure epoxy, when it is room temperature and power frequency.","PeriodicalId":437475,"journal":{"name":"2013 IEEE International Conference on Solid Dielectrics (ICSD)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Conference on Solid Dielectrics (ICSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSD.2013.6619856","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

Abstract

Epoxy/organic-montmorillonite nanocomposites were prepared with different organic-montmorillonite and content of montmorillonite by diglycidyl ether of bisphenol A. Chemical composition of different organic-montmorillonite was analyzed by Fourier Transition Infrared(FTIR). The temperature properties of resistivity of composites were measured by Megger. The temperature dependence of composites dielectric spectrum was verified by using a Schering bridge. The results show that whether octadecyl ammonium chloride or the coupling agent KH550, they can interact with the montmorillonite both. The test results of the composite indicated that, inclusion of K-MMT and O-MMT into epoxy matrix can reduce permittivity and dissipation factor. The permittivity and dissipation factor of K-MMT/EP composites respectively reduced 5% and 35%, and those of O-MMT/EP composites respectively reduced 16% and 41%, when testing temperature is 160°C. It can be confirmed that epoxy improved by organic-montmorillonite is provided with better heat resistance property than those of pure epoxy. As for O-MMT/EP composites, the permittivity and dissipation factor of composites that contains 5wt% O-MMT is lowest. For instance, the permittivity reduced 18% and the dissipation factor reduced 42% than pure epoxy, when it is room temperature and power frequency.

查看原文本刊更多论文

界面极化对环氧-蒙脱土复合材料介电性能的影响

以不同有机蒙脱土和双酚a二缩水甘油酯为原料制备了环氧/有机蒙脱土纳米复合材料，并用傅里叶跃迁红外(FTIR)分析了不同有机蒙脱土的化学成分。用兆欧表测量了复合材料的电阻率温度特性。利用先灵桥验证了复合材料介电谱的温度依赖性。结果表明，无论是十八烷基氯化铵还是偶联剂KH550，都能与蒙脱土相互作用。复合材料的测试结果表明，在环氧基体中加入K-MMT和O-MMT可以降低复合材料的介电常数和耗散系数。当测试温度为160℃时，K-MMT/EP复合材料的介电常数和耗散系数分别降低了5%和35%，O-MMT/EP复合材料的介电常数和耗散系数分别降低了16%和41%。结果表明，有机蒙脱土改性环氧树脂具有比纯环氧树脂更好的耐热性能。对于O-MMT/EP复合材料，当O-MMT含量为5wt%时，复合材料的介电常数和耗散系数最低。例如，在室温和工频下，与纯环氧树脂相比，其介电常数降低了18%，耗散系数降低了42%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2013 IEEE International Conference on Solid Dielectrics (ICSD)

自引率

0.00%

发文量