Integrated flash memory and logic testing-a high volume, low cost approach

Abstract

The semiconductor industry's trend to offer more value-added products that integrate flash memory with logic devices poses a significant challenge to manufacturing test operations. This paper details those challenges and how they were systematically overcome on a lead product at Intel Penang. The end result is a manufacturing process whose productivity, cost and HVM (high volume manufacturing) indicators are equivalent to those of stand-alone logic devices. These techniques can be proliferated to other types of integrated devices.