Internal Surface Finishing of Small Hole by Electrochemical Processing Using Soluble Fluid for Honing

Y. Uno, A. Okada, S. Naka, Shoichi Yamamoto, Y. Sakane
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Abstract

Honing has been widely applied to engine cylinders, hydraulic cylinders, nozzles, valves and so on, since not only surface roughness but also roundness and straightness of a hole can be improved by this process. However, in the case of surface roughness less than 1μm Ry, a burr formed by abrasives significantly influences the surface roughness and makes it difficult to attain a better surface. In addition, the machining efficiency significantly decreases, since loading of the stick occurs frequently and several hones have to be prepared. In this study, in order to achieve high accuracy and efficiency in internal surface finishing with less surface roughness, the fundamental effects of electrochemical finishing after honing on surface integrity in the case of using a honing machine with soluble fluid as an electrolyte, are experimentally discussed.Experimental analysis clarified that a suitable electrolytic current density condition existed for improving the surface roughness, and also that passive film generation on the machined surface could be prevented by mixing inverse electrolytic current with the normal one. Then, it was pointed out that the surface roughness could be reduced, since only protruding parts were selectively removed under the suitable condition, even when a soluble fluid was used as an electrolyte. Therefore, this method has the possibility of being a highly efficient internal surface finishing process of small holes after honing.
利用可溶珩磨液电化学加工小孔内表面
珩磨不仅可以提高孔的表面粗糙度,而且可以提高孔的圆度和直线度,因此珩磨已广泛应用于发动机缸、液压缸、喷管、阀门等领域。然而,在表面粗糙度小于1μm Ry的情况下,磨料形成的毛刺会显著影响表面粗糙度,难以获得更好的表面。此外,加工效率显著降低,因为粘杆加载频繁,必须准备几个珩磨。在本研究中,为了在较小的表面粗糙度下实现高精度和高效率的内表面精加工,实验讨论了在以可溶性流体作为电解液的珩磨机中,珩磨后电化学精加工对表面完整性的基本影响。实验分析表明,存在一个适宜的电解电流密度条件来改善表面粗糙度,并且通过将反电解电流与正电解电流混合可以防止加工表面产生钝化膜。然后指出,在适当的条件下,即使使用可溶性流体作为电解质,也可以选择性地去除突出的部分,从而降低表面粗糙度。因此,该方法有可能成为珩磨后小孔的高效内表面精加工工艺。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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