Fabrication and testing of thermoelectric thin film devices

A. V. Wagner, R. Foreman, L. Summers, T. Barbee, J. Farmer
{"title":"Fabrication and testing of thermoelectric thin film devices","authors":"A. V. Wagner, R. Foreman, L. Summers, T. Barbee, J. Farmer","doi":"10.2172/212542","DOIUrl":null,"url":null,"abstract":"Two thin-film thermoelectric devices are experimentally demonstrated. The relevant thermal loads on the cold junction of these devices are determined. The analytical form of the equation that describes the thermal loading of the device enables us to model the performance based on the independently measured electronic properties of the films forming the devices. This model elucidates which parameters determine device performance, and how they can be used to maximize performance.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2172/212542","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

Two thin-film thermoelectric devices are experimentally demonstrated. The relevant thermal loads on the cold junction of these devices are determined. The analytical form of the equation that describes the thermal loading of the device enables us to model the performance based on the independently measured electronic properties of the films forming the devices. This model elucidates which parameters determine device performance, and how they can be used to maximize performance.
热电薄膜器件的制造与测试
实验证明了两种薄膜热电器件。确定了这些器件冷端相关的热负荷。描述器件热负荷的方程的解析形式使我们能够根据形成器件的薄膜的独立测量的电子特性对性能进行建模。该模型阐明了哪些参数决定设备性能,以及如何使用它们来最大化性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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