Simultaneous Gate and Interconnect Sizing for Circuit-Level Delay Optimization

N. Menezes, S. Pullela, L. Pileggi
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引用次数: 26

Abstract

With delays due to the physical interconnect dominating the overall logic path delays, circuit-level delay optimization must take interconnect effects into account. Instead of sizing only the gates along the critical paths for delay reduction, the trade-off possible by simultaneously sizing gate and interconnect must also be considered. We show that for optimal gate and interconnect sizing, it is imperative that the interaction between the driver and the RC interconnect load be taken into account. We present an iterative sensitivity-based approach to simultaneous gate and interconnect sizing in terms of a gate delay model which captures this interaction. During each iteration, the path delay sensitivities are efficiently calculated and used to size the components along a path.
电路级延迟优化的同时门和互连尺寸
由于物理互连造成的延迟占整个逻辑路径延迟的主导地位,电路级延迟优化必须考虑互连效应。为了减少延迟,我们不能只对关键路径上的门进行尺寸调整,还必须考虑同时对门和互连进行尺寸调整所带来的折衷。我们表明,为了优化栅极和互连尺寸,必须考虑驱动器和RC互连负载之间的相互作用。我们提出了一种基于迭代灵敏度的方法,根据捕获这种相互作用的门延迟模型来确定同时门和互连的尺寸。在每次迭代中,有效地计算路径延迟灵敏度,并用于沿路径的组件大小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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