700V PIC technology based on 0.35µm design for AC-DC power units

T. Karino, O. Sasaki, M. Yamaji, H. Sumida
{"title":"700V PIC technology based on 0.35µm design for AC-DC power units","authors":"T. Karino, O. Sasaki, M. Yamaji, H. Sumida","doi":"10.1109/ISPSD.2012.6229060","DOIUrl":null,"url":null,"abstract":"We have established the 700V-class PIC technology based on 0.35μm design to provide power management ICs with higher performances and lower chip cost for the first time. And a 700V PWM-IC based on 0.35μm design, whose chip size can be reduced to 50% that of the IC based on 1.0μm design, is realized. This paper will report our developed 700V PIC technology with a PWM-IC product designed by this technology.","PeriodicalId":371298,"journal":{"name":"2012 24th International Symposium on Power Semiconductor Devices and ICs","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 24th International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2012.6229060","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

We have established the 700V-class PIC technology based on 0.35μm design to provide power management ICs with higher performances and lower chip cost for the first time. And a 700V PWM-IC based on 0.35μm design, whose chip size can be reduced to 50% that of the IC based on 1.0μm design, is realized. This paper will report our developed 700V PIC technology with a PWM-IC product designed by this technology.
基于0.35µm的700V PIC技术设计的交直流电源单元
我们建立了基于0.35μm设计的700v级PIC技术,首次提供更高性能和更低芯片成本的电源管理ic。实现了基于0.35μm设计的700V pwm集成电路,其芯片尺寸比基于1.0μm设计的集成电路减小了50%。本文将介绍我们开发的700V PIC技术以及采用该技术设计的pwm集成电路产品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信