A Study of Connectors and Feed Lines De-Embedding Techniques for PCB Microwave Components S-Parameters Measurements Up To 50 Ghz

Abstract

Connectors and lines de-embedding techniques for PCB microwave components S-parameters measurements up to 50 are considered. Comparison between widely used Multiline Thru-Reflect-Line (MTRL) method and promising 2xThru method are presented. This paper has demonstrated that both methods give same results, however, 2xThru method requires just one measured structure as opposite MTRL, where six measured structures are used. The difference between obtained and measured parameters of device under test are less than 0.35 dB in magnitude and 1.5° in phase for insertion loss, and less than 0.08 in magnitude and 10° in phase for return loss at most frequency points.