Sub-THz micromachined waveguides for wafer level integration of MMICs

Abstract

We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.