Challenges of reuse and remanufacturing of modern chips in smart mobile devices

Sitek Janusz, Koscielski Marek, Arazna Aneta, Stęplewski Wojciech, Janeczek Kamil
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引用次数: 3

Abstract

The overview of the main challenges and barriers related with the issues of reuse and remanufacturing of components from smart mobile devices were presented. The authors mainly focused on the current state of the art as well as the preliminary remarks from first investigation of the “sustainablySMART” H2020 project were presented. It was stated that both in reuse and remanufacturing processes of modern chips the main role plays: economic profitability of processes, environmental benefits and costs of processing needed for remanufacturing of components, as well as technical feasibility of components remanufacturing in the way enable their safe application in other products.
智能移动设备中现代芯片再利用和再制造的挑战
概述了与智能移动设备部件再利用和再制造相关的主要挑战和障碍。作者主要关注了目前的技术状况,以及对“sustainablySMART”H2020项目的首次调查的初步评论。有人指出,在现代芯片的再使用和再制造过程中,主要作用是:过程的经济效益、部件再制造所需的环境效益和加工成本,以及部件再制造的技术可行性,使其能够安全应用于其他产品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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