Applicability of no-flow fluxing encapsulants and flip chip technology in volume production

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Pub Date : 2000-06-18 DOI:10.1109/ADHES.2000.860592

P. Palm, K. Puhakka, J. Maattanen, T. Heimonen, A. Tuominen

{"title":"Applicability of no-flow fluxing encapsulants and flip chip technology in volume production","authors":"P. Palm, K. Puhakka, J. Maattanen, T. Heimonen, A. Tuominen","doi":"10.1109/ADHES.2000.860592","DOIUrl":null,"url":null,"abstract":"Applicability of no-flow fluxing encapsulants and flip chip technology in volume production was studied. Adhesion of the underfill materials to different solder resists was measured with single lap shear test and the results compared with traditional underfills. No-flow underfiller was dispensed with standard in line dispenser. SnPb-bumped flip chip test structures were pick and placed on FR4 substrates by using standard volume production line. The bump pitch of the test chips was 250 /spl mu/m. Sample boards were also precured in standard production oven and postcured in baking oven. No-flow underfillers showed exceptionally good adhesion to used solder resists. With the no-flow underfillers flip chip proved to be transparent to the current SMA process, however the process window for dispensing and reflowing is relatively narrow.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860592","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

Abstract

Applicability of no-flow fluxing encapsulants and flip chip technology in volume production was studied. Adhesion of the underfill materials to different solder resists was measured with single lap shear test and the results compared with traditional underfills. No-flow underfiller was dispensed with standard in line dispenser. SnPb-bumped flip chip test structures were pick and placed on FR4 substrates by using standard volume production line. The bump pitch of the test chips was 250 /spl mu/m. Sample boards were also precured in standard production oven and postcured in baking oven. No-flow underfillers showed exceptionally good adhesion to used solder resists. With the no-flow underfillers flip chip proved to be transparent to the current SMA process, however the process window for dispensing and reflowing is relatively narrow.

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无流焊剂封装和倒装芯片技术在批量生产中的适用性

研究了无流熔剂封装和倒装芯片技术在批量生产中的适用性。通过单搭接剪切试验，测定了底填材料对不同抗焊剂的附着力，并与传统底填材料进行了对比。用标准的在线点胶机分配无流底填料。采用标准量产生产线将snpb碰撞倒装芯片测试结构挑选并放置在FR4基板上。测试芯片的凹凸节距为250 /spl mu/m。样品板也在标准生产烘箱中进行了预处理，并在烘箱中进行了后固化。无流动填料对使用的阻焊剂表现出非常好的附着力。无流动下填料倒装芯片被证明对目前的SMA工艺是透明的，但是分配和回流的工艺窗口相对较窄。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)

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