A Numerical Method for a Full-Wave Electromagnetic Analysis of Systems on Chip

N. Tanguy, P. Bréhonnet, T. Le Gouguec, P. Martin, D. Deschacht, Y. Quéré, P. Vilbé, L. Calvez, F. Huret
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引用次数: 2

Abstract

In the context of RF and high-speed circuits, Systems On Chip with Analog and Mixed Signals (SOC-AMS), interconnect has becoming a dominant factor in determining circuit performance and reliability in deep submicron designs. Transmission line properties of on-chip wiring need to be taken into account due to the great lengths and fast rise times encountered. Coupling noise between adjacent interconnects can also cause catastrophic effects on the logical functionality and long-term reliability of a VLSI circuit. With these trends, the electrical phenomena that have to be investigated are governed by the electromagnetic theory. However, it's impossible to proceed to a complete SOC - AMS analysis with a full wave electromagnetic numerical tool, due to the large scale integration. As interconnects are typically of very large size and high-order, model-order reduction becomes necessary for efficient SOC modeling, simulation, design and optimization. In this communication, a new method based on numerical inversion of Laplace transform and on a discrete model-reduction technique is presented for simulating peak crosstalk noise problems found in high speed digital circuits and SOC-AMS. The method, particularly efficient and easy to be implemented in a program, is useful for an electromagnetic simulation of a complete system.
片上系统全波电磁分析的数值方法
在射频和高速电路的背景下,模拟和混合信号片上系统(SOC-AMS)互连已成为决定深亚微米设计中电路性能和可靠性的主要因素。片上布线的传输线特性需要考虑,因为遇到了很长的长度和快速上升时间。相邻互连之间的耦合噪声也会对VLSI电路的逻辑功能和长期可靠性造成灾难性影响。有了这些趋势,必须研究的电现象就受电磁理论的支配。然而,由于大规模集成,用全波电磁数值工具进行完整的SOC - AMS分析是不可能的。由于互连通常具有非常大的尺寸和高阶,因此模型阶数降低对于有效的SOC建模、仿真、设计和优化是必要的。本文提出了一种基于拉普拉斯变换数值反演和离散模型缩减技术的新方法,用于模拟高速数字电路和SOC-AMS中的峰值串扰噪声问题。该方法效率高,易于在程序中实现,可用于整个系统的电磁仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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