Ultra-high speed Direct Tunneling Memory (DTM) for embedded RAM applications

K. Tsunoda, A. Sato, H. Tashiro, K. Ohira, T. Nakanishi, H. Tanaka, Y. Arimoto
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引用次数: 3

Abstract

Direct Tunneling Memory (DTM) with ultra-thin tunnel oxide and novel depleted floating gate (FG) has been demonstrated for embedded RAM applications. Fast programming (<10ns) at low voltage, together with its excellent charge retention (>10s) and large threshold voltage difference (>1.3V), has been achieved by utilizing the band bending at the FG/oxide interface in charge retention period. The depleted FG is also effective to suppress the degradation of program/erase speed caused by the gate re-oxidation process. As a consequence, newly proposed DTM is a promising candidate for cost-effective and scalable embedded RAM instead of a conventional embedded DRAM.
用于嵌入式RAM应用的超高速直接隧道存储器(DTM)
采用超薄隧道氧化物和新型耗尽浮栅(FG)的直接隧道存储器(DTM)已被证明可用于嵌入式RAM。利用FG/氧化物界面在电荷保持期的能带弯曲,实现了快速编程(10s)和大的阈值电压差(>1.3V)。耗尽的FG还能有效抑制栅再氧化过程引起的程序/擦除速度的下降。因此,新提出的DTM是具有成本效益和可扩展的嵌入式RAM的有前途的候选人,而不是传统的嵌入式DRAM。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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