Relation between reliability and yield of ICs based on discrete defect distribution model

Tianxu Zhao, Y. Hao, Peijun Ma, Ta-Te Chen
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引用次数: 1

Abstract

Yield and reliability are two important factors affecting the development of semiconductor manufacturing. It is an important problem, how to express the relation between yield and reliability. In this paper, a model of the relation is given between yield and reliability based on a discrete yield model, many factors are considered in this model, such as the line width, the spacing between the lines as well as the distribution of the defect size and so on. Finally, the validity of this model is shown by simulation.
基于离散缺陷分布模型的集成电路可靠性与良率关系
良率和可靠性是影响半导体制造业发展的两个重要因素。如何表达成品率与可靠性之间的关系是一个重要的问题。本文在离散良率模型的基础上,建立了良率与可靠性的关系模型,该模型考虑了线宽、线间距、缺陷尺寸分布等因素。最后,通过仿真验证了该模型的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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