Highly sensitive inspection system for lithography-related faults in agile-fab detecting algorithm, monitoring and evaluation of yield impact

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 1900-01-01 DOI:10.1109/ISSM.2001.962957

H. Matsushita, K. Mitsutake, Y. Arakawa, T. Ishibumi, Y. Ushiku

引用次数: 0

Abstract

We performed automatic detection of lithography-related faults by characteristic factors calculated from Fail Bit Count (FBC) data. The frequency of lithography-related faults was monitored as time series data and their origin was specified by correlating machine data. We could classify lithography-related faults and evaluate their yield impact from their frequency and yield loss automatically.

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针对光刻相关故障的高灵敏度检测系统中的敏捷晶圆厂检测算法、良率影响的监测与评估

利用失效比特数(FBC)数据计算特征因子，实现了光刻相关故障的自动检测。将光刻相关故障的频率作为时间序列数据进行监测，并通过相关的机器数据确定故障的来源。该方法可以对光刻相关故障进行分类，并根据故障发生频率和成品率损失自动评估其对成品率的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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