Advanced PECVD technology for manufacturing AM LCDs

C. Tsai, Q. Shang, T. Takehara, W. Harshbarger, K. Law
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引用次数: 1

Abstract

PECVD is one of the most critical technologies for manufacturing AM LCD devices. Advanced PECVD systems have been developed for low temperature deposition of a-Si, SiN/sub x/, SiO/sub 2/, SiON, and n-Si films. Typically, cluster tool configurations are used since they provide excellent process control with single substrate processing and flexible process flows. Recent reports indicate that good polysilicon TFTs have been manufactured using laser crystallization of a-Si precursor films. This paper reviews the development of PECVD systems for volume manufacturing of LCDs and discusses process technology and requirements for future manufacturing.
先进的PECVD技术制造AM液晶
PECVD是制造AM LCD器件的最关键技术之一。先进的PECVD系统已开发用于低温沉积a-Si, SiN/sub x/, SiO/sub 2/, SiON和n-Si薄膜。通常,使用集群工具配置,因为它们通过单一基材加工和灵活的工艺流程提供了出色的过程控制。最近的报道表明,利用激光结晶的a-Si前驱体薄膜已经制造出了良好的多晶硅tft。本文回顾了用于lcd批量生产的PECVD系统的发展,并讨论了未来制造的工艺技术和要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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