Soft-error tolerance of an optically reconfigurable gate array VLSI

Takumi Fujimori, Minoru Watanabe
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Abstract

The damaged reactors and melted nuclear fuel of the Fukushima Daiichi nuclear power plant present an extremely intense radiation environment. Decommissioning project members are estimating that the maximum radiation intensity around the melted reactors and melted nuclear fuel is 1000 Sv/h. Since humans cannot approach the region, robots must take the lead in decommissioning operations. Such robots need semiconductor devices for operations. However, such devices are exceptionally vulnerable to radiation. Therefore, a radiation-hardened optically reconfigurable gate array (ORGA) has under development Although the ORGA is also constructed using the same radiation-vulnerable semiconductor technology as that used in currently available radiation-hardened devices, ORGAs use a holographic memory technology to increase the radiation tolerance of semiconductor device components. The soft-error tolerance has been confirmed using an americium alpha particle radiation source (Am-241) as 181 times higher than Artix-7 FPGAs using a high-speed optical scrubbing operation.
光可重构门阵列VLSI的软误差容忍度
福岛第一核电站受损的反应堆和熔化的核燃料呈现出极强的辐射环境。退役项目成员估计,熔化的反应堆和熔化的核燃料周围的最大辐射强度为1000西沃特/小时。由于人类无法接近该区域,因此机器人必须带头进行退役操作。这样的机器人需要半导体设备来操作。然而,这种设备特别容易受到辐射的影响。因此,一种抗辐射光可重构门阵列(ORGA)正在开发中,尽管ORGA也使用与目前可用的抗辐射器件相同的易受辐射影响的半导体技术,但ORGA使用全息存储技术来增加半导体器件组件的辐射容限。使用镅α粒子辐射源(Am-241)确认的软误差容限比使用高速光学擦洗操作的Artix-7 fpga高181倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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