Screening of Integrated GaAs Stacked-FET Power Amplifiers

G. V. D. Bent, A. P. de Hek, F. V. van Vliet
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Abstract

The manufacturing of radar front-ends is preferably performed with components that are fully tested and known to be functional. This decreases the chances of instant failure or rapid degradation of the system. Complete testing of the RF-performance of the individual MMICs, however, is not always possible due to technical, infrastructural or financial limitations. A good alternative is the screening of several DC parameters that are relevant for a reliable operation. Commonly used parameters for this DC-screening are the pinch-off voltage and off-state breakdown voltage of the transistors. To measure these parameters on all transistors, access is required to the gate, drain and source terminals of these transistors. In a Stacked-FET amplifier not all transistors terminals are directly accessible via DC pads and the inclusion of extra pads will result in a significantly larger layout. The goal therefore is to measure the DC behaviour without the need for extra DC pads. In this article methods are developed to support this goal.
集成GaAs堆叠fet功率放大器的筛选
雷达前端的制造最好使用经过充分测试并已知具有功能的组件。这减少了系统出现即时故障或快速降级的机会。然而,由于技术、基础设施或财务限制,对单个mmic的射频性能进行全面测试并不总是可能的。一个很好的替代方案是筛选与可靠运行相关的几个直流参数。这种直流屏蔽常用的参数是晶体管的引脚电压和断态击穿电压。为了测量所有晶体管上的这些参数,需要接入这些晶体管的栅极、漏极和源端。在堆叠fet放大器中,并不是所有的晶体管终端都可以通过直流焊盘直接访问,包含额外的焊盘将导致更大的布局。因此,目标是在不需要额外的直流焊盘的情况下测量直流行为。在本文中,开发了一些方法来支持这一目标。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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