Transferring porous layer from InP wafer based on the disturbance

Yang Zhang, Liang Cao, X. Chai, Kaihua Liang, Yonglu Han, Yanqi Wang, Zhaoyang Wang, Shuting Wang, Z. Weng, Zuobin Wang
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引用次数: 3

Abstract

We present a new method to transfer the three dimensional (3D) porous layer from InP wafer based on the disturbance, during electrochemical etching of n-InP (100) with chronopotentiometry with current ramp in 3 mol-L−1 NaCl solution. The potential bursting phenomenon was observed due to the disturbing instantaneously. In addition, the correlation between the amplitude of the potential and the porous layers separated from the InP wafer was discussed.
基于扰动从InP晶圆转移多孔层
在3 mol-L−1 NaCl溶液中,利用时间电位法和电流斜坡法对n-InP(100)进行电化学刻蚀时的扰动,提出了一种从InP晶圆上转移三维多孔层的新方法。由于瞬时扰动,观察到潜在的爆破现象。此外,还讨论了电位的振幅与从InP晶圆上分离的多孔层之间的关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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