Device challenges and opportunities

C. Hu
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引用次数: 55

Abstract

CMOS technology is facing exciting opportunities and formidable challenges. They include mobility scaling to overcome the speed/power barrier, new gate-stack materials and/or new device structures; to overcome the gate-length/leakage barrier; nonvolatile memory and universal memory to enlarge the market, and containment of costs. CMOS has much more to give in the next two decades, yet it is not too early, especially in universities, to start searching for not-CMOS-like circuit/system architectures that may require non-existing new devices but offer the promise of dramatic reduction in power and cost.
设备挑战与机遇
CMOS技术正面临着令人兴奋的机遇和艰巨的挑战。它们包括克服速度/功率障碍的移动性缩放,新的栅极堆栈材料和/或新的器件结构;克服闸长/泄漏屏障;非易失性存储器和通用存储器扩大市场,并遏制成本。在接下来的二十年里,CMOS有更多的东西要做,但现在开始寻找不像CMOS的电路/系统架构还为时过早,尤其是在大学里,这些架构可能需要不存在的新器件,但却有望大幅降低功耗和成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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