Remote Configuration of Integrated Circuit Features and Firmware Management via Smart Contract

Md. Nazmul Islam, S. Kundu
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引用次数: 6

Abstract

The cost to develop a new integrated circuit (IC), its fabrication, debug and volume production has been escalating with scaling of transistor feature size. According to an IBS report, the cost of developing a System on Chip (SoC) at 14nm may be as high as $300 million [1]. The economics of semiconductor IC development favors high volume production, while high volume cannot be attained without developing an IC that serves a large number of applications. Some of these applications are in low margin Internet of Things (IoT) devices, where an SoC cannot command a high price. Consequently, without the ability to customize IC features after production, the price of an IC will be determined by its lowest priced application. This motivates the manufacturers to develop capabilities for post-production IC customization. The commodity microprocessor business offers an example of post-production customization, where a manufacturer can tailor cache size, number of cores and frequency of operation for a target market segment after a chip has been manufactured. Today, such customization is limited to one-time programming (OTP) for predetermined IC bins. In this paper, we explore how an IC can be programmed repeatedly and securely using a blockchain-based smart contract. This will enable users to upgrade IC features, or rent upgraded IC features for a fixed period after it has been purchased. The availability of such a system could, for example, allow a buyer to upgrade her processor from i3 to i5 after it has been purchased to scale to her computing needs in exchange of a payment made to the manufacturer. IC feature configuration is implemented by firmware updates from the manufacturer. The smart contract takes the feature configuration request from the IC as input and outputs the source of corresponding firmware. To support remote and authorized update by manufacturer, we propose an on-die hardware module that communicates with the smart contract and enforces its functionalities. Availability of this module also facilitates secure firmware update. The blockchain makes the update protocol secure and prevents users from obtaining unauthorized update.
基于智能合约的集成电路功能远程配置和固件管理
新型集成电路(IC)的开发、制造、调试和量产成本随着晶体管特征尺寸的增大而不断上升。根据IBS的一份报告,开发14nm的系统芯片(SoC)的成本可能高达3亿美元[1]。半导体集成电路开发的经济倾向于大批量生产,而如果不开发服务于大量应用的集成电路,就无法实现大批量生产。其中一些应用是在低利润率的物联网(IoT)设备中,SoC无法获得高价格。因此,在生产后没有能力定制IC功能,IC的价格将由其最低价格的应用决定。这促使制造商开发后期集成电路定制能力。商品微处理器业务提供了一个后期定制的例子,在芯片制造完成后,制造商可以为目标市场细分定制缓存大小、内核数量和操作频率。目前,这种定制仅限于针对预定IC箱的一次性编程(OTP)。在本文中,我们探索了如何使用基于区块链的智能合约对IC进行重复和安全地编程。这将使用户能够升级IC功能,或在购买后的固定期限内租用升级后的IC功能。例如,这种系统的可用性可以允许买家在购买处理器后将其从i3升级到i5,以扩展到她的计算需求,以换取向制造商付款。IC功能配置由制造商的固件更新实现。智能合约将来自IC的特征配置请求作为输入,并输出相应固件的来源。为了支持制造商的远程和授权更新,我们提出了一个芯片上的硬件模块,该模块与智能合约通信并执行其功能。该模块的可用性还有助于安全的固件更新。区块链使更新协议安全,并防止用户获取未经授权的更新。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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