Database Construction and SPC Technology for Solder Paste Defect Inspection

Abstract

This paper puts forward a method to construct a certain database for the process of solder paste defect inspection to sort and process various kinds of printing defect information, and realizes the data monitoring by Statistical Process Control (SPC) technology. Firstly, establish an appropriate database by SQL Server Management Studio for different kinds of printing defect information, such as excess solder, insufficient solder, solder missing, solder splash, solder offset, etc. Then, build the report server by SQL Server Business Intelligence Development Studio. Finally, complete the drawing of attribute control chart and variable control chart combining the theory of SPC. These different charts reflect the probability of various kinds of defects and their distribution in enterprise production. The new method improves the process control ability of enterprises in the production process scientifically and excellently.