Experimental Measurements of Thermal Performances of Carbon Nanomaterial with Vertical Structures in Hotspot Heat Dissipation *

Yan Zhang, Longwang Tan, Hang Yin, Guoqiang Zhang, Johan Liu
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Abstract

The dramatic progresses in electronics technologies in recent years bring forwards higher requests for quick and valid heat dissipation. Thermal management has become a vital issue in the performance and lifetime reliability of electronic devices and products with high packaging density. Carbon nanomaterials have attracted great attention due to their distinctive structures and excellent properties. In this paper, two kinds of carbon nanomaterials with vertical structures, namely carbon nanowalls and vertically aligned carbon nanofibers, have been prepared and tested to evaluate their heat dissipation performance. Experimental measurements have been carried out to obtain the hotspot temperatures of a test chip with and without the carbon nanomaterials applied. Comparisons of temperature values of the chip at various power loadings show that the utilization of both the carbon nanowalls and the carbon nanofibers can effectively decrease the hotspot temperature. And the heat dissipation improvement is remarkable at a high power density.
垂直结构碳纳米材料在热点散热中的热性能实验测量*
近年来,电子技术的飞速发展对快速有效的散热提出了更高的要求。热管理已成为影响高封装密度电子器件和产品性能和寿命可靠性的关键问题。碳纳米材料以其独特的结构和优异的性能受到了人们的广泛关注。本文制备了两种垂直结构的碳纳米材料,即碳纳米墙和垂直排列的碳纳米纤维,并对其散热性能进行了测试。通过实验测量,获得了应用碳纳米材料和不应用碳纳米材料的测试芯片的热点温度。通过对不同功率负载下芯片温控值的比较,表明碳纳米墙和碳纳米纤维的使用都能有效降低芯片的热点温度。在高功率密度下,散热性能的改善是显著的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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