Multi-physical simulation of high performance computing platform integrating polymer waveguides

Abstract

This work presents a general simulation approach for all relevant physical effects in electro-optical circuit boards. Such printed circuit boards integrate electrical components and connections together with optical wave-guides as signal lines for applications in data transmission and sensing. The proposed modelling approach includes a calculation of heat distribution based on convective cooling and the thermally induced mechanical stress. We also present results on mode shapes within straight and uniformly curved waveguides as well as a consideration of ray tracing.