Direct measurement of residual contact area and volume during the nanoindentation of coated materials as an alternative method of calculating hardness

N. Randall
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引用次数: 23

Abstract

Abstract The mechanical properties of thin films can be measured by a variety of different techniques, with nanoindentation being one of the most recent developments in this growing field. By using a depth-sensing indentation method it is possible to obtain quantitative values for the hardness and modulus and thus to gain better insight into the response of a material to controlled deformation at such small scales. However, previous work by Tsui and Pharr has shown that the effects of pile-up, particularly in soft films deposited on hard substrates, can produce significant overestimation of the hardness and modulus due to an underestimation of the true contact area by common nanoindentation analysis procedures. By measuring the topography of the residual indent using scanning force microscopy (SFM) and combining this information with the indentation data, it is possible to gain a fuller understanding of the indentation method and its effects on the material being tested. In addition, the true contact area can be directly measured from the SFM images and subsequently used to recalculate the hardness of the material more accurately. Moreover, the SFM allows the plastic volume of indentation to be measured, from which hardness can also be calculated in terms of plastic work. Experimental results are presented for two types of thin film deposited on hard substrates where SFM analysis of indentations at various depths gives significant additional information concerning the true response of the system to instrumented indentation at a nanometric scale. Pile-up effects can be precisely monitored as a function of depth and correlated to hardness variations encountered across the coating-substrate interface.
直接测量涂层材料在纳米压痕过程中的剩余接触面积和体积,作为计算硬度的一种替代方法
薄膜的机械性能可以通过各种不同的技术来测量,纳米压痕是这一领域的最新发展之一。通过使用深度感测压痕方法,可以获得硬度和模量的定量值,从而更好地了解材料对如此小尺度的受控变形的响应。然而,Tsui和farr之前的研究表明,堆积的影响,特别是在硬基板上沉积的软膜中,由于普通纳米压痕分析程序低估了真正的接触面积,可能会导致硬度和模量的显著高估。通过使用扫描力显微镜(SFM)测量残余压痕的形貌,并将这些信息与压痕数据相结合,可以更全面地了解压痕方法及其对被测材料的影响。此外,可以直接从SFM图像中测量真实接触面积,随后用于更准确地重新计算材料的硬度。此外,SFM允许测量压痕的塑性体积,由此也可以根据塑性功计算硬度。实验结果提出了两种类型的薄膜沉积在硬基板上,在不同深度的压痕的SFM分析提供了重要的附加信息,关于系统的真实响应,在纳米尺度上的仪器压痕。堆积效应可以作为深度的函数和与涂层-衬底界面上遇到的硬度变化相关的函数来精确监测。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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