Electrical properties of Si-XII and Si-III formed by nanoindentation

Y. Wang, S. Ruffell, K. Sears, A. Knights, J. Bradby, J.S. Williams
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引用次数: 11

Abstract

Conventional silicon devices and integrated circuits are fabricated in the diamond cubic phase of silicon, so-called Si-I. Other phases of silicon can be formed under pressure applied by indentation and these phases are metastable at room-temperature and pressure. As we demonstrate, such phases behave entirely differently to normal diamond-cubic silicon (Si-I) having different electrical properties. Two such phases, Si-III (BC8) and Si-XII (R8), can be formed by indentation but little is known about their electrical properties. Theoretical studies predict Si-III to be a semimetal [1] and Si-XII to be a narrow band gap semiconductor [2]. We report the first electrical measurements on these phases, which we have formed by nanoindentation. We demonstrate that Si-XII is a semiconductor that can be electrically doped with boron and phosphorus at room temperature. We also demonstrate early devices formed by nanoindentation at room temperature.
纳米压痕形成的Si-XII和Si-III的电学性质
传统的硅器件和集成电路是在硅的金刚石立方相(Si-I)中制造的。硅的其他相可以在压痕施加的压力下形成,这些相在室温和压力下是亚稳的。正如我们所展示的,这些相的行为完全不同于具有不同电性能的普通金刚石立方硅(Si-I)。两种这样的相Si-III (BC8)和Si-XII (R8)可以通过压痕形成,但对它们的电学性质知之甚少。理论研究预测Si-III为半金属[1],Si-XII为窄带隙半导体[2]。我们报告了对这些相的首次电测量,这些相是我们通过纳米压痕形成的。我们证明了Si-XII是一种可以在室温下电掺杂硼和磷的半导体。我们还展示了在室温下由纳米压痕形成的早期器件。
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