A Low-Profile RF Wire-to-Board Connector Design for Millimeter Wave Applications

2020 IEEE USNC-CNC-URSI North American Radio Science Meeting (Joint with AP-S Symposium) Pub Date : 2020-07-05 DOI:10.23919/USNC/URSI49741.2020.9321653

Yu-Cheng Huang, Chen-Pang Chao, Ming‐Jie Gao, Yi-Wen Chiu, Chang-Fa Yang, Shih-Chieh Chen, Jaisy Kung, George Wei

引用次数: 1

Abstract

A low-profile RF wire-to-board connector design for 5G mobile communications and WiGig applications is presented in this paper. A new connector structure with a mating height of only 0.7mm to achieve a bandwidth from DC up to 70GHz is proposed. This RF connector design may provide jump wire connections in devices for 5G wireless communications and other millimeter wave systems.

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一种用于毫米波应用的低规格射频线对板连接器设计

本文提出了一种用于5G移动通信和WiGig应用的低轮廓射频线对板连接器设计。提出了一种新的连接器结构，其配合高度仅为0.7mm，可实现从直流到70GHz的带宽。这种射频连接器设计可以为5G无线通信和其他毫米波系统的设备提供跳线连接。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2020 IEEE USNC-CNC-URSI North American Radio Science Meeting (Joint with AP-S Symposium)

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