Invited tutorial: MEMS: Driving advances in electronic devices

Abstract

The goal of the course is to give you a brief overview of MEMS technologies by covering packaging, reliability, simulation, and testing. We will venture into recent developments like Sensor Fusion, Integrated CMOS-MEMS, and BioMEMS. You will gain an in-depth knowledge of challenges and opportunities associated with bringing MEMS-based products to market through the course's focus on two key topics: (1) MEMS Packaging - You will learn packaging concepts for MEMS devices while reviewing assembly and packaging procedures such as structural release, cleaning, encapsulation, and testing. The tutorial will also cover various challenges associated with packaging and testing MEMS. (2) MEMS Reliability - This tutorial will review MEMS reliability issues and associated analysis/simulation techniques. MEMS reliability requires a broad understanding of physics, material science, and mechanics in order to handle the challenges during research, development, and productization.