Reduced Setup Time for an SMT Line

Abstract

The article seeks to investigate the cause in the model changeover delay in the operational process of an automatic surface mount device (SMD) insertion line of TV boards, identifying the factor that causes the time to perform SETUP using the Six Sigma to perform analysis of the results achieved. The tools applied were the process flow mapping, the Ishikawa cause and effect diagram and the Six Sigma standard planning, execution, verification and action cycle, which facilitated data collection and analysis of activities that were divided into: external and internal activities. Through this procedure it was possible to perform the recording and analysis of the data collected. The balancing of the processes and activities of the line before and during the exchange of the SETUP model, displacing external activities that were performed as internal. The next step was to standardize the activities in the process, known as Surface Mount Technology (SMT). The modification of the developed processes was of vital importance to the feeding of machines with higher quality and in a shorter time, determining and separating the common items from the exclusive ones. For this to happen, it was necessary to reprogram the machines. The model identified as critical and a 55-inch TV, the time before the study was over 80 minutes and was reduced to 40 minutes after the actions were implemented. The paper presents clearly how it was obtained and the gains in detail.