on-Demand system reliability: The DeSyRe project

I. Sourdis
{"title":"on-Demand system reliability: The DeSyRe project","authors":"I. Sourdis","doi":"10.1109/SAMOS.2013.6621130","DOIUrl":null,"url":null,"abstract":"Summary form only given. The DeSyRe project builds on-demand adaptive, reliable Systems-on-Chips. In response to the current semiconductor technology trends that make chips becoming less reliable, DeSyRe describes a new generation of by design reliable systems, at a reduced power and performance cost. This is achieved through the following main contributions. DeSyRe defines a fault-tolerant system architecture built out of unreliable components, rather than aiming at totally fault-free, and hence more costly chips. In addition, DeSyRe systems are on-demand adaptive to various types and densities of faults, as well as to other system constraints and application requirements. For leveraging on-demand adaptation/customization and reliability at reduced cost, a new dynamically reconfigurable substrate is proposed and combined with runtime system software support. The above define a generic and repeatable design framework for a large variety of SoCs, which within the project - is applied to two medical SoCs with high reliability constraints and diverse performance and power requirements. In this talk, an overview of the DeSyRe and our current research findings are described.","PeriodicalId":382307,"journal":{"name":"2013 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SAMOS.2013.6621130","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Summary form only given. The DeSyRe project builds on-demand adaptive, reliable Systems-on-Chips. In response to the current semiconductor technology trends that make chips becoming less reliable, DeSyRe describes a new generation of by design reliable systems, at a reduced power and performance cost. This is achieved through the following main contributions. DeSyRe defines a fault-tolerant system architecture built out of unreliable components, rather than aiming at totally fault-free, and hence more costly chips. In addition, DeSyRe systems are on-demand adaptive to various types and densities of faults, as well as to other system constraints and application requirements. For leveraging on-demand adaptation/customization and reliability at reduced cost, a new dynamically reconfigurable substrate is proposed and combined with runtime system software support. The above define a generic and repeatable design framework for a large variety of SoCs, which within the project - is applied to two medical SoCs with high reliability constraints and diverse performance and power requirements. In this talk, an overview of the DeSyRe and our current research findings are described.
按需系统可靠性:DeSyRe项目
只提供摘要形式。DeSyRe项目构建了按需自适应、可靠的片上系统。为了应对当前使芯片变得不那么可靠的半导体技术趋势,DeSyRe描述了新一代设计可靠的系统,其功耗和性能成本都较低。这是通过以下主要贡献实现的。DeSyRe定义了一个由不可靠组件构建的容错系统架构,而不是以完全无故障为目标,因此芯片成本更高。此外,DeSyRe系统可按需适应各种类型和密度的故障,以及其他系统约束和应用需求。为了利用按需适应/定制和降低成本的可靠性,提出了一种新的动态可重构基板,并将其与运行时系统软件支持相结合。上述定义了用于各种soc的通用和可重复设计框架,该框架在项目中应用于具有高可靠性限制和不同性能和功率要求的两种医疗soc。在这次演讲中,概述了DeSyRe和我们目前的研究成果。
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