Technologies for Next Generation T/R Modules

Abstract

Technologies to enable the next generation of transmit/receive modules for sensor and communications systems are being pursued in programs funded by the Defense Advanced Research Projects Agency (DARPA). DARPA programs contributing to dramatically improved performance and wafer-scale integration for T/R modules will be highlighted. These programs include the Wide Band Gap Semiconductors for RF Applications (WBGS-RF) program, the Scalable Millimeter Wave Architectures for Reconfigurable Transceivers (SMART) program, the Integrated Sensor Is Structure Critical Technology Demonstration (ISIS-CTD), and the Sub-millimeter Wave Imaging Focal-plane Technology (SWIFT) program.