Fault coverage analysis using fault model and functional testing for DPM reduction

K. R. Thilak, S. Gayathri
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引用次数: 3

Abstract

In today's fast growing and increasing complex world of VLSI circuits, test quality has significant effect on the quality of the product. A malfunctioning circuit is a result of design flaw, manufacturing defects or both. Testing is used as a measure to estimate the quality of design. High quality testing minimizes defect-per-million (DPM) and thus can significantly reduce manufacturing costs and increase product yield. Automatic test pattern generator (ATPG) is one of the structural methods used to get good coverage. To estimate the overall outgoing DPM(Defective Parts per Million) in High Volume Manufacturing (HVM) functional test cases are written manually in order to target the areas which are not detected by structural testing methods like ATPG (Automatic Test Pattern Generator). When the test vectors are used for manufacturing testing, their quality for detecting manufacturing defects needs to be evaluated. Fault simulation is known to be a reliable means for determining the single stuck-at fault coverage provided by a set of test vectors. The degree to which a test vector suite detects the faults is known as the fault coverage of the suite. This procedure referred as fault grading.
用故障模型和功能测试进行故障覆盖分析,降低DPM
在VLSI电路快速发展和日益复杂的今天,测试质量对产品质量有着重要的影响。电路故障是设计缺陷、制造缺陷或两者兼而有之的结果。测试是用来评估设计质量的一种手段。高质量的测试将百万分之缺缺率(DPM)降至最低,因此可以显著降低制造成本并提高产品产量。自动测试图发生器(ATPG)是获得良好覆盖的结构方法之一。为了估计大批量生产(HVM)中总体输出的DPM(每百万次品),功能测试用例是手动编写的,目的是针对结构测试方法(如ATPG(自动测试模式生成器))无法检测到的区域。当测试向量用于制造测试时,需要对其检测制造缺陷的质量进行评估。故障模拟是一种可靠的方法,可以确定由一组测试向量提供的单卡故障覆盖率。测试向量套件检测故障的程度称为套件的故障覆盖率。这个过程称为故障分级。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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