The effect of ground bond-wire on the performance of CMOS class-E power amplifiers

Masoud Yavari, S. Naseh
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Abstract

The effect of the ground bond-wire inductance on the performance of class-E power amplifiers is analyzed and investigated. It is shown that for a given supply voltage and output power, this inductance decreases the value of the series excessive reactance and the voltage stress on the active device. The simulation results of a quasi-ideal circuit and a CMOS circuit in presence of a typical ground bond-wire inductance of 1 nH are presented to validate the analysis.
地结合线对CMOS e类功率放大器性能的影响
分析研究了e类功率放大器接地键线电感对其性能的影响。结果表明,对于给定的电源电压和输出功率,该电感降低了串联过抗的值和有源器件上的电压应力。在典型接地键线电感为1nh的情况下,给出了准理想电路和CMOS电路的仿真结果来验证分析的正确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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