{"title":"Modeling and characterization studies of parasitic elements in lead-on-chip thin-small-outline packaging","authors":"Pak-Hong Yee, Siu-Waf Low, Y. Swee","doi":"10.1109/IEMTIM.1998.704661","DOIUrl":null,"url":null,"abstract":"Parameters affecting the parastic elements of a lead-on-chip (LOC) thin small outline package (TSOP) were studied by modeling with a TI internal RLC extractor and measurement technique using a vector network analyzer (VNA). Variation in the resistance (R), inductance (L) and capacitance (C) of a TSOP with respect to changes in the lead dimensions were assessed by modeling with a line-and-space pattern based on the TSOP geometry. The effect on RLC due to changes in the lead-to-ground separation, electrical properties of the materials and frequency were assessed by modeling based on a 54-pin TSOP applied to 64 Mb/spl times/16 SDRAM. Measurement was made to confirm the frequency dependence of RLC for Alloy42 (A42), copper (Cu) and palladium plated copper (Pd-Cu) as leadframe material. Some fundamentals for packaging design are summarized. For instance, L can be reduced by increasing lead width and decreasing lead-to-ground separation simultaneously. In frequency studies, it is found that the A42 leadframe has a higher frequency dependence on R and L, and is thus electrically inferior to Cu and Pd-Cu leadframes.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMTIM.1998.704661","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Parameters affecting the parastic elements of a lead-on-chip (LOC) thin small outline package (TSOP) were studied by modeling with a TI internal RLC extractor and measurement technique using a vector network analyzer (VNA). Variation in the resistance (R), inductance (L) and capacitance (C) of a TSOP with respect to changes in the lead dimensions were assessed by modeling with a line-and-space pattern based on the TSOP geometry. The effect on RLC due to changes in the lead-to-ground separation, electrical properties of the materials and frequency were assessed by modeling based on a 54-pin TSOP applied to 64 Mb/spl times/16 SDRAM. Measurement was made to confirm the frequency dependence of RLC for Alloy42 (A42), copper (Cu) and palladium plated copper (Pd-Cu) as leadframe material. Some fundamentals for packaging design are summarized. For instance, L can be reduced by increasing lead width and decreasing lead-to-ground separation simultaneously. In frequency studies, it is found that the A42 leadframe has a higher frequency dependence on R and L, and is thus electrically inferior to Cu and Pd-Cu leadframes.