Boundary scan testing combined with power supply current monitoring

Proceedings of European Design and Test Conference EDAC-ETC-EUROASIC Pub Date : 1994-02-28 DOI:10.1109/EDTC.1994.326872

M. Kärkkäinen, Kari Tiensyrjä, Matti Weissenfelt

引用次数: 3

Abstract

The monitoring of power supply current is presented for detecting manufacturing defects in printed circuit boards. Simple and inexpensive test equipment consisting of PC and interface card has been developed to support current monitoring by utilizing IEEE 1149.1 standard test architecture.<>

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边界扫描测试与电源电流监测相结合

提出了一种检测印刷电路板制造缺陷的电源电流监测方法。利用IEEE 1149.1标准测试体系结构，开发了由PC机和接口卡组成的简单廉价的测试设备，以支持电流监测。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of European Design and Test Conference EDAC-ETC-EUROASIC

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