Flip-chip assembly for senior designs in the 21/sup st/ century

Abstract

A new thermosonic flip-chip bonding technology has been developed. It is compatible with wire bonding and eliminates the need of solder bumping on wafers. As a result, this technology could be applied to enhance Senior Design type of courses using flip-chip assembly to design, assemble and test innovative systems. The technology will be described with a list of different modules prototyped for microelectronics, optoelectronics, microwave/millimeter-wave, and microelectromechanical systems. We are looking for collaborators to investigate different possible curricular enhancements using this new technology.