Miniaturized wide- and dual-band multilayer electromagnetic bandgap for antenna isolation and on-package/PCB noise suppression

P. Bantavis, M. Le Roy, A. Pérennec, R. Lababidi, D. Le jeune
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引用次数: 1

Abstract

This work presents a new design approach of wideband multilayer Electromagnetic Band Gaps (EBGs) suitable for both on package antenna isolation and switching noise suppression in high speed digital circuits. Depending on the target applications, the design principle is implemented from two conventional types of EBGs in order to improve their initial performance. By stacking multiple dielectric layers with integrated vias in both types of EBGs, it's possible to achieve dual band performance, to enhance the relative bandwidth of the first band gap and to miniaturize the unit cell. The dispersion diagrams of the multilayer EBGs are proposed and full-wave simulations are performed to validate the antenna isolation and noise suppression bandwidths of the final structures.
用于天线隔离和封装/PCB噪声抑制的小型化宽频和双频多层电磁带隙
本文提出了一种适用于高速数字电路中封装天线隔离和开关噪声抑制的宽带多层电磁带隙的新设计方法。根据目标应用,设计原则由两种传统类型的ebg实现,以提高其初始性能。通过在两种类型的ebg中堆叠带有集成过孔的多个介电层,可以实现双带性能,提高第一个带隙的相对带宽,并使单元电池小型化。提出了多层EBGs的色散图,并进行了全波仿真,验证了最终结构的天线隔离和噪声抑制带宽。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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