Electron mobility model for silicon carbide inversion layers

Y. Zeng, M. White
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引用次数: 2

Abstract

This paper presents, a physically based inversion layer electron mobility model which takes into account the combined effects of surface roughness and coulomb scattering the two main mechanisms limiting the electron mobility in SiC MOSFETs. The MOSFET was fabricated on an aluminium-implanted surface and the transfer characteristics are analysed, then the corresponding transconductance curves are compared.
碳化硅反转层的电子迁移率模型
本文提出了一个基于物理的反演层电子迁移率模型,该模型考虑了表面粗糙度和库仑散射这两种限制碳化硅mosfet中电子迁移率的主要机制的综合影响。在铝注入表面上制备了MOSFET,分析了其转移特性,并比较了相应的跨导曲线。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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