Multiscale Modeling of Bonded T-Joints Using Atomistically Informed Method of Cells

Ashwin Rai, A. Chattopadhyay
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Abstract

In this research, a multiscale modeling framework is developed and applied to the analysis of adhesively bonded composite joints under mechanical loading. The primary goal is to obtain an improved understanding of damage initiation and failure at the relevant length scales and predicting the consequent effects at the structural scale. The methodology utilizes damage information at the atomic level, addressed using molecular dynamics (MD), and couples it with a method of cells based micromechanics model for the nonlinear and damage analysis of carbon fiber reinforced polymer (CFRP) composite. This damage analysis technique is then used to predict the multiscale nonlinear effects in hot-spot zones, such as the adhesive/adherend interface, in adhesively bonded T-joints which will assist in the development of methods for prevention or delay of the most common forms of failure in such built-up components.
基于细胞原子信息方法的键合t型接头多尺度建模
在本研究中,开发了一种多尺度建模框架,并将其应用于粘接复合材料接头在机械载荷作用下的分析。主要目标是在相关长度尺度上获得对损伤起始和破坏的更好理解,并预测结构尺度上的后续影响。该方法利用原子水平的损伤信息,使用分子动力学(MD)进行处理,并将其与基于细胞的微观力学模型相结合,用于碳纤维增强聚合物(CFRP)复合材料的非线性和损伤分析。然后使用这种损伤分析技术来预测粘接t型接头中热点区域(如粘接界面)的多尺度非线性效应,这将有助于开发预防或延迟此类组合部件中最常见失效形式的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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