{"title":"Optical interconnects for chip-to-chip communications","authors":"M. Fields","doi":"10.1109/ECOC.2010.5621147","DOIUrl":null,"url":null,"abstract":"Large-scale routers, supercomputers and datacenters all have internal networks for chip-to-chip communications with bandwidth, density, and power requirements that can surpass the capabilities of copper solutions. We review current state-of-the-art technologies, such as Avago's MicroPOD parallel optical modules.","PeriodicalId":391144,"journal":{"name":"36th European Conference and Exhibition on Optical Communication","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"36th European Conference and Exhibition on Optical Communication","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECOC.2010.5621147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 23
Abstract
Large-scale routers, supercomputers and datacenters all have internal networks for chip-to-chip communications with bandwidth, density, and power requirements that can surpass the capabilities of copper solutions. We review current state-of-the-art technologies, such as Avago's MicroPOD parallel optical modules.