Crosstalk Analysis and Countermeasures of High-Density Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory

Abstract

This paper conducts an in-depth analysis of crosstalk in a multi-hop inductive coupling interface for a 3D-stacked memory and proposes two countermeasures. The crosstalk among seven stacked dies is analyzed based on 3D electromagnetic (EM) simulation. The detailed analysis reveals two main crosstalk sources: concentric coils and adjacent coils. To suppress theses crosstalk, this work proposes two corresponding countermeasures: shorted coils and 8-shaped coils. The combination of the shorted coils and 8-shaped coils improves area-efficiency by a factor of 4 in simulation. These techniques enable a high-density inducive coupling interface for a high-bandwidth stacked memory.