Overall equipment effectiveness (OEE) and cost measurement [semiconductor manufacturing]

Abstract

Total Productive Maintenance (TPM) has provided a new perspective on semiconductor manufacturing. The need to improve performance requires more focus than ever on the TPM metric of Overall Equipment Effectiveness (OEE). Investigation of this data with a productivity analysis framework called the Capacity Utilization Bottleneck Efficiency System (CUBES) identifies and prioritizes productivity inefficiencies with their accompanying tool capacity decreases. A proposal for an extension of the CUBES to reflect cost measurement associated with these inefficiencies is discussed.