The establishment of a multi-chip module foundry at RIT

Abstract

Faculty from the Rochester Institute of Technology's (RIT's) College of Engineering and College of Science have formed a group aimed at advanced multichip module (MCM) packaging of high-speed electronics systems. The authors discuss the cooperation between university, industry, and ultimately the government in an attempt to open up the field of MCM design, fabrication, and use in an educational setting. This group has begun fabrication of both a process evaluation module and actual application-specific modules. The key aspect of the RIT MCM effort is the establishment of an MCM foundry at RIT. The foundry would not be a large-volume foundry, but would provide for internal and supported external MCM fabrication needs. RIT offers a unique fabrication opportunity for MCMs and would like to work with other companies and universities to maximize the exposure of this technology.<>