SOFTWARE PACKAGE FOR MULTIPHYSICS AND MULTI-LEVEL CALCULATIONS

Mathematical modeling in materials science of electronic component Pub Date : 2021-10-27 DOI:10.29003/m2463.mmmsec-2021/38-42

K. Abgaryan, E. Gavrilov

引用次数: 0

Abstract

The report is devoted to demonstration of the main ideas and approaches, which were used in the construction of a software package for multiphysics and multilevel calculations. Such a software package is used as information support for solving multiscale problems in the field of microelectronics.

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软件包的多物理场和多层次的计算

该报告致力于演示用于构建多物理场和多能级计算软件包的主要思想和方法。该软件包可作为解决微电子领域多尺度问题的信息支持。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Mathematical modeling in materials science of electronic component

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