Modeling Techniques and Virtual Prototyping of Silicon Carbide MOSFET and IGBT Power Modules

Abstract

In the fast-growing market of electric vehicles, power modules, used as switching elements for the main traction inverter feeding the electrical motor, are playing a key role. In this context a robust and reliable methodology has to be developed to assess the power modules' electro-thermal behaviour at the early design stage. The final goal of this paper is to describe this methodology, developed by using Finite Element Analysis (FEA) and SPICE circuit simulations, to help define a more robust solution and to verify compliance with the mission profile at hand.