Failure Analysis of Glass Transition Temperature of LED Insulation Layer

Yibin Wang, Fang Fang, Jing Wu, Kaixuan Lin, Tingting Xu, W.-J. Liang, Luqiao Yin
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Abstract

With the development of light-emitting diodes (LEDs) technology, the number of LEDs chips in high-power LEDs devices is increasing, and the use of LEDs continues to expand, the reliability has become the key to its widespread use. When the LEDs device fails, the failure analysis of the device can effectively derive the mechanism and condition of the device failure, which has a significant effect on enhancing the reliability of the device. In this paper, by analyzing the instantaneous voltage curve and thermal of the failed device, it can be concluded that when the operating current of the LEDs device is large, due to the poor thermal conductivity of the insulating layer, the insulating layer of the device is in the vitrification transition temperature for a long time. The shape of the insulating layer is easily changed or even burned to cause delamination, resulting in LEDs failure.
LED绝缘层玻璃化转变温度失效分析
随着发光二极管(led)技术的发展,大功率led器件中led芯片的数量不断增加,led的使用范围不断扩大,可靠性成为其广泛使用的关键。当led器件发生故障时,对器件进行故障分析可以有效地推导出器件故障的机理和条件,对提高器件的可靠性有显著的作用。本文通过分析失效器件的瞬时电压曲线和热特性,可以得出结论:当led器件工作电流较大时,由于绝缘层导热性差,器件绝缘层长期处于玻璃化转变温度。绝缘层的形状很容易改变,甚至烧毁,造成分层,导致led失效。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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