{"title":"Failure Analysis of Glass Transition Temperature of LED Insulation Layer","authors":"Yibin Wang, Fang Fang, Jing Wu, Kaixuan Lin, Tingting Xu, W.-J. Liang, Luqiao Yin","doi":"10.1109/SSLChinaIFWS49075.2019.9019815","DOIUrl":null,"url":null,"abstract":"With the development of light-emitting diodes (LEDs) technology, the number of LEDs chips in high-power LEDs devices is increasing, and the use of LEDs continues to expand, the reliability has become the key to its widespread use. When the LEDs device fails, the failure analysis of the device can effectively derive the mechanism and condition of the device failure, which has a significant effect on enhancing the reliability of the device. In this paper, by analyzing the instantaneous voltage curve and thermal of the failed device, it can be concluded that when the operating current of the LEDs device is large, due to the poor thermal conductivity of the insulating layer, the insulating layer of the device is in the vitrification transition temperature for a long time. The shape of the insulating layer is easily changed or even burned to cause delamination, resulting in LEDs failure.","PeriodicalId":315846,"journal":{"name":"2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)","volume":"12 8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SSLChinaIFWS49075.2019.9019815","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
With the development of light-emitting diodes (LEDs) technology, the number of LEDs chips in high-power LEDs devices is increasing, and the use of LEDs continues to expand, the reliability has become the key to its widespread use. When the LEDs device fails, the failure analysis of the device can effectively derive the mechanism and condition of the device failure, which has a significant effect on enhancing the reliability of the device. In this paper, by analyzing the instantaneous voltage curve and thermal of the failed device, it can be concluded that when the operating current of the LEDs device is large, due to the poor thermal conductivity of the insulating layer, the insulating layer of the device is in the vitrification transition temperature for a long time. The shape of the insulating layer is easily changed or even burned to cause delamination, resulting in LEDs failure.